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YEStech
 
YTV B3 AOI YTV Series AOI YTX - 3000 X-Ray

YTV B3 AOI
 
Benchtop Automated Optical Inspection
Download Specification Sheet (PDF)
The B3 is equally effective for pre / post-reflow or even final assembly inspection. Remote programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
  • Quick Set-up
  • Color Camera
  • High Defect Coverage
  • Low False Failure Rate
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YTV Series AOI
 
Automated PCB Inspection
Download Specification Sheet (PDF)
Programming the F-Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The F1-Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.

Newly available image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.

Configurable for all line positions, the F1-Series is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
  • Quick Set-up
  • Color Camera
  • High Defect Coverage
  • Low False Failure Rate
  • Best Price Performance
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YTX - 3000 X-Ray
 
High Resolution X-Ray System
Download Specification Sheet (PDF)
The YTX-3000 x-ray system offers EMS providers and semiconductor packagers a superior yield enhancement solution to reduce costs, improve quality and increase throughput.

The YEStech YTX-3000 provides users with a high-resolution x-ray capability in a flexible, compact maintenance free configuration. The YTX-3000 is available with a 4 or 5 axis sample manipulator and a 15" x 20" (380mm x 508mm) x-y travel for samples up to 5 pounds in weight. Full 360 degrees of rotation and 30 degrees of tilt are available. Stepper motor drives provide a wide range of motion from ultra-slow use at high magnifications, to high speed for travel over large distances. All systems come with a unique control module and programmable motion for automated inspection.

The YTX-3000 comes with YEStech's proprietary machine vision technology for fully automated inspection of BGA and flip chip devices. Other optional inspections include die attach, bond wire and correct assembly verification.
  • High Performance
  • Maintenance Free
  • Cost Effective
  • Superior Software
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